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At this point the electrodes can be lowered somewhat and gold-plated if desired. After gold-plating and impedance measurement, the gold pins should be secured to the eib with a thin layer of 5-minute epoxy. Use a thin wire or similar tool to distribute the epoxy between the pins so it makes good contact with the EIB and the pins, otherwise its possible that the epoxy stays on top of the pins and tetrode stubs, especially on the dense small 64ch EIBs. When re-using the EIB for another drive later, this epoxy can be removed easily by leaving the EIB in ethanol for a few days. This softens the epoxy so it can be easily removed. Also make sure to remove the epoxy from the omnetics connector(s), also under the solder feet, and re-epoxy the connector.
The drive is now ready to implant.